Joint University Microelectronics Program launched with $250 million
The Semiconductor Research Corporation (SRC), in partnership with the Defense Advanced Research Projects Agency (DARPA) and industry and academic stakeholders, has announced the launch of a $250 million consortium dedicated to leap-ahead microelectronics.
The Joint University Microelectronics Program 2.0 (JUMP 2.0) is an SRC-led public-private initiative that will pursue high-risk, high-payoff research spanning seven U.S. university research centers, each exploring complementary themes. An expansion of the original JUMP collaboration, JUMP 2.0 aims to improve performance, efficiency, and capabilities using innovations across a range of electronics systems, including novel materials, devices, architectures, algorithms, designs, and integration techniques.
Recipients include Georgia Institute of Technology, which was awarded $65 million for two research centers, the Center for the Co-Design of Cognitive Systems, which will research AI systems and architectures, and the Center on Cognitive Multispectral Sensors, which will research sensing capabilities and embedded intelligence to enable fast and efficient generation of actions. In addition, SRC awarded $35 million to UC San Diego, which will support the Center for Processing with Intelligent Storage and Memory; $33 million to Pennsylvania State University in support of the Center for Heterogeneous Integration of Micro Electronic Systems; and $34 million to Cornell University in support of the Superior Energy-Efficient Materials and Devices (SUPREME) project.
“We are at an inflection point in the evolution of computing systems and technologies,” said Roman Caudillo, Intel-SRC assignee and JUMP 2.0 Director. “The JUMP 2.0 program will be a key component in identifying and forging the best path forward by driving public-private investment for disruptive innovation in microelectronics systems at scale. I look forward to helping guide the semiconductor industry through the SRC JUMP 2.0 program and in cooperation with DARPA in the years to come.”
(Photo credit: Getty Images/crstrbrt)
